Company dossier / 18 October 2026
TSMC
Semiconductor foundry and advanced packaging
| Product | Semiconductor foundry and advanced packaging |
|---|---|
| Buyer category | Chip designers procuring manufacturing capacity |
| Revenue model | Manufacturing services |
| Recorded metric | US$122.42bn consolidated revenue; 59.9% gross margin |
| Period / scope | FY2025 |
| Evidence class | Published annual report |
| Alternatives / editorial mapping | Samsung Foundry and Intel Foundry are adjacent foundry alternatives; process availability differs. |
| Risk to investigate / editorial analysis | Capacity investment, utilization and technology execution. |
| Next diligence question / editorial analysis | Can packaging, wafer capacity and customer designs ramp together? |
Source record
2025 annual report · Reviewed 18 October 2026. Metrics are historical snapshots, not live data. Company disclosures have not been independently audited by Offaxis.
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